Hydroxypropyl methylcellulose synthetic adhesive
Release Date:
2021-03-02
Adhesives are generally divided into three types: organic adhesives, inorganic adhesives, and metal powder adhesives. Common organic adhesives mainly include epoxy adhesives and silicone adhesives. The main performance difference between them and inorganic adhesives is temperature resistance.
Adhesives are generally divided into three types: organic adhesives, inorganic adhesives, and metal powder adhesives. Common organic adhesives mainly include epoxy adhesives and silicone adhesives. The main performance difference between them and inorganic adhesives is temperature resistance. The maximum temperature resistance of organic adhesives is usually between 100-250 degrees Celsius, generally not exceeding 400 degrees. Inorganic adhesives typically have a temperature resistance ranging from 600 to 1750 degrees Celsius. Organic adhesives can be either flexible or rigid, while inorganic adhesives are usually rigid. Common metal powder adhesives mainly include some low melting point metal powders, and their temperature resistance depends on the melting point of the metal powder.
Organic adhesives mainly include epoxy adhesives, silicone adhesives, and acrylic adhesives.
Inorganic adhesives mainly include silicate-based adhesives, phosphate-based adhesives, aluminates, and others.
Metal powder adhesives mainly include pure aluminum powder and others.
Among them, organic adhesives are the most widely used, and epoxy adhesives within organic adhesives are closely related to our daily lives!
Epoxy adhesives
Typically, in the absence of oxygen, the thermal decomposition temperature of epoxy resin exceeds 300°C. When used in air, thermal oxidative decomposition usually occurs between 180 and 200°C. After aging at this temperature for some time, the strength may even decrease further. Most alicyclic epoxy resins are relatively stable below 200°C, but thermal oxidative damage is more severe than that of bisphenol A epoxy resins above 200°C. This may be because alicyclic structures lack the stability of aromatic rings. The thermal oxidative stability of bisphenol A epoxy resins cured with aromatic amines is inferior to that of alicyclic A-type epoxy resins cured with alicyclic or aromatic anhydrides, due to the presence of more hydroxyl groups in the amine-cured epoxy structure. Dehydration reactions easily occur at lower temperatures. Additionally, nitrogen atoms on the amines are more susceptible to thermal oxidative damage. However, few hydroxyl groups form in anhydride-cured products. Nevertheless, the molecular chains of epoxy resins cured by both types of curing agents begin to break down above 290°C. From the above, it can be seen that bisphenol A epoxy resins have poor high-temperature resistance. Anhydride-cured products have higher temperature resistance than those cured with aromatic amines.
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